2000 Puffs Disposable ecig have a completely enclosed design, reducing the need for charging and replacing cartridges. The no-charge design also reduces the occurrence of faults. It is understood that with rechargeable e-cigarettes, each cartridge needs to be charged at least once and the battery efficiency is extremely low, while the design of disposable ecig can solve this problem very well. 2000 Puff E-Cigarette,2000 Puff E-Cigarette For Sale,Best 2000 Puff E-Cigarette,Best 2000 Puff E-Cigarette For Sale Shenzhen E-wisdom Network Technology Co., Ltd. , https://www.globale-wisdom.com
On January 13th, the major science and technology project of Henan Province, which was declared by Jingcheng (Zhengzhou) Technology Co., Ltd., was held at the Xingya Jianguo Hotel, which is also the Henan Province this year. The second time, the major science and technology projects declared by Zhengzhou enterprises were demonstrated. Vice Mayor Sun Jinxian attended the seminar and delivered a speech.
In his speech, Sun Jinxian hopes that Jingcheng Company will take this argumentation meeting as an opportunity to strengthen communication and contact with experts and accelerate the development of new products and projects. And said that the municipal government will actively create conditions, create an environment, and provide all-round support and services for project research and development and industrialization.
After on-site inspection, project introduction, expert defense, etc., the expert group agreed that the technical route of the project is feasible, with strong technical and industrial strength, and the expected product technical performance indicators meet the special requirements of major science and technology projects in Henan Province. Necessary and significant promotion significance.
High-power LED driver IC is a key component of LED lighting fixtures, a key technology research and industrialization project for high-power LED driver ICs. The main goal of the research is to develop new packaging technologies suitable for packaging high-power LED driver ICs to solve the heat dissipation of driver ICs. The problem is to realize the industrialization of high-power LED driver ICs. 