After Apple (Apple) equipped its fingerprint recognition function in its smartphone iPhone 5s, the non-Ping camp mobile phone factory is also fully following up, making the fingerprint identification market hot. In fact, Apple is not the first brand to put fingerprint recognition into smartphones; it is understood that Fujitsu and Motorola have already launched smart phones with capacitive fingerprinting in 2008 and 2012 respectively. However, it did not become the focus of the market at that time. The main reason for this is that the user experience of fingerprint identification is difficult to meet consumer expectations. However, Apple covers the scratch-resistant, anti-dirty Sapphire substrate on the capacitive fingerprint sensor, so that the sensor has the ability to resist various external forces such as anti-static, acid and so on, allowing fingerprint identification. Sensing sensitivity has been greatly improved, which has once again spurred the development of fingerprint recognition function, and further stimulated the speed of the introduction of fingerprint identification technology by mobile device manufacturers in the non-Ping camp. It is understood that in order to compete with the fingerprint recognition function in Apple's iPhone 5s, the non-Ping camp mobile device brand is planning to adopt fingerprint-based chip-on-chip (Chip-on-Flex, CoF) packaging technology. Modules, lower cost and higher production yields, compete with Apple and accelerate the penetration of fingerprint recognition on mobile devices. Reduce the cost of fingerprint identification module, non-flat camp embraces CoF architecture Figure 1 Chen Lingjun, IC and Process Researcher, IEK Electronics and Systems Research Group, ITRI, said that in order to reduce the cost of fingerprint identification modules, the non-Ping camp will tend to adopt the CoF package architecture. Chen Lingjun (Fig. 1), a system IC and process researcher at the IEK Electronics and Systems Research Group of the ITRI, said that in order to prevent Apple from concentrating on the former, non-flat operators also concentrated their resources on investing in another fingerprint identification technology provider, Validity. Will be different from Apple in design and cost, hoping to catch up with Apple in the shortest possible time. In fact, Validity's investors are almost always the main force of the non-Ping camp, such as Intel Capital, Qualcomm's venture capital - Qualcomm Ventures, TSMC's venture capital - VentureTech Alliance, and Samsung, the leading smartphone manufacturer (Samsung) ) has also taken a share in the past few days. In addition, after Validity was acquired by SynapTIcs in early October 2013, market participants are more optimistic that Validity will become the largest supplier of mobile device fingerprint sensing modules in the non-Ping camp. It is understood that AuthenTec, a fingerprint sensor supplier purchased by Apple in 2012, is mainly used to develop high-order applications such as defense, military, and customs. higher cost. In addition, the AuthenTec fingerprint identification sensor module used in the Apple iPhone 5s, in addition to the integrated touch sensor, the material also uses a sapphire substrate, so that the overall sensing module cost rises again, and the price range is roughly estimated. At $10-13, it's about two to three times the value of the Validity solution. Chen Lingjun pointed out that compared to AuthenTec's complex module structure and high cost, Validity fingerprint identification technology specifications are lower, suitable for medium and low-end applications, such as mobile devices; therefore, the advantage of Validity is that its module design is relatively simple and can be adopted. A CoF package architecture with high yield, simple process, and lower cost. Not only that, Validity's CoF architecture consists of a fingerprint sensing chip attached to a low-cost/high-ductility Metallized Kapton Film. This package architecture and materials are used in comparison to silicon substrates. It can reduce costs and provide greater design flexibility, so it is well received by the non-Ping camp. On the other hand, because Apple's capacitive fingerprint sensor needs to integrate special application integrated circuits (ASIC), pressure/image sensors, optical lenses, etc. on a single component, the production yield is still not high so far. Therefore, the process and supply chain components are also more complicated. Chen Lingjun further explained that AuthenTec's sensor chip is mainly produced by TSMC, and the redistribution process (RDL) is supported by Fine Materials Technology and China's Crystal Semiconductor. After purchasing materials/wafers through the ring, it is completed by ASE. Bonding, and finally by Foxconn fit; in contrast, Validity's sensor chip, although also by TSMC foundry, and then directly to the Tailin test and Nanmao support CoF packaging technology can be shipped, the process is relatively simple. In fact, in addition to the introduction of high-end mobile phone manufacturers, the low-end smartphone industry is also eager to apply fingerprint identification. It is understood that the touch IC and LCD driver IC (Daily) Duntai Electronics have also begun to deploy fingerprint identification technology, and it is expected to launch the fingerprint identification sensor module in the second half of 2014. Some customers, such as Huawei, ZTE, Lenovo, Yulong Coolpad, etc., are also expected to carry fingerprint recognition on their mobile phones. In addition, Chen Lingjun pointed out that because the Dentai e-customer group is a low-end smartphone brand factory, the company can also hope to adopt a CoF package architecture to reduce costs. It is worth noting that, in view of the fact that smartphones are expected to introduce fingerprint recognition functions in 2014, developers of various fingerprint identification and sensing schemes will be further encouraged to step up the layout, and the capacitive fingerprint identification technology adopted by Apple iPhone 5s will be adopted. As a result, it is expected that various fingerprint identification schemes will be in full bloom in the smartphone market. Mobile phone import demand can be fingerprinted Figure 2 Wu Renjie, deputy general manager of Jinhao Technology, pointed out that in addition to capacitive type, the fingerprint identification scheme of mobile devices in the future has optical, thermal sensing and pressure sensing solutions. Wu Renjie, deputy general manager of Jinhao Technology (Fig. 2), said that after the introduction of the capacitive fingerprint sensing device on the iPhone 5s, the capacitive sensing scheme became a trend of the moment; while focusing on the fingerprint recognition function, it is expected to become a smart phone in the future. Standard equipment, developers of various fingerprint identification and sensing solutions are all in full force, hope to grab the supply chain of smart phones. 5.08Mm Ribbon Connector,Pressure Connector,Electrical Connector,Wire-To-Board Connector YUEQING WEIMAI ELECTRONICS CO.,LTD , https://www.weimaiconn.com
