"In 2012, LED packaging field, enterprise competition and layout, latest technology research and development trends, market price trends and other aspects will be the focus of the entire LED industry to focus on." Green Lighting Shanghai Organizing Committee head said: "As 2012 In the first half of the most influential industrial activities in the country, we will pay close attention to the latest developments in the domestic LED industry chain, and will pass the authority of 2012 Shanghai International Lighting & New Energy Lighting Exhibition & Forum (Green Lighting Shanghai 2012). , professional and international exchange platform presented to industry professionals."

Hotspot 1: domestic LED package re-shuffled by IPO

In 2012, with the help of capital markets, the domestic LED packaging industry will further release the production capacity and intensify the competitive pressure. The first to be eliminated at the end is a group of small and medium-sized package factories with weak technical and market capabilities.

At present, there are 1,200-1,500 packaging companies in China, with more than 40 first camps with annual sales of over 100 million yuan, and less than 400 second-tier companies with sales between 10 million yuan and 100 million yuan. About 30%, most of the company's sales are less than 10 million yuan. This is a far cry from the average sales of 1 billion yuan in Taiwan's eight largest listed companies.

As of the end of January 2012, except for 7 listed companies, including National Star, Lehman Optoelectronics, Ruifeng Optoelectronics, Hongli Optoelectronics, Vanguard Technology, Jufa Optoelectronics, and Long Semiconductor, etc., February 1, 2012, the Securities Regulatory Commission A total of 515 IPO applications for the list of companies under review will be announced, and at least nine LED companies are waiting in line. According to statistics, there are currently 40 to 60 LED companies that are actively engaged in the reform of the shareholding system, including many LED packaging companies. It is expected that there will be more LED companies impacting IPOs in 2012, and more than 20 LED industry stocks will be listed and traded at the end of the year. .

According to the person in charge of the Green Lighting Shanghai Organizing Committee, in view of the fierce competition in the LED packaging industry in China in 2012, more manufacturers chose to increase promotion efforts and expand market share in order to avoid a phased predicament caused by excess capacity in the upcoming 2012 Shanghai. At the International Lighting & New Energy Lighting Fair & Forum (Green Lighting Shanghai 2012), there will be a group of LED package manufacturers from both China and Taiwan.

In 2012, the pattern competition of the LED packaging industry will start between the first camp and the packaging listed companies. At present, some listed companies have quietly started layout cooperation. Will appear in 2013.

Hotspot II: Four Development Trends of LED Packaging Technology in 2012

Currently, LED packaging technology mainly develops in four directions: high luminous efficiency, high reliability, high heat dissipation capacity, and thin profile. The main highlights at present are: silicon-based LED, COB packaging technology, flip-chip LED chip packaging, and high-voltage LED. It will also be presented to industry professionals through the authoritative, professional and international communication platform of 2012 Shanghai International Lighting & New Energy Lighting Exhibition & Forum (Green Lighting Shanghai 2012).

The reason why the silicon-based LED has caused more and more attention in the industry is because it has a higher heat dissipation capacity than a traditional sapphire-based LED, so the power can be made even bigger. Cree focused on the development of silicon-based LED, which currently exists. The main problem is that the yield rate is still low, resulting in high costs.

COB light source is relatively low in production cost, has obvious heat dissipation function, and has the features of high packing density and high optical density, and is easy to carry out personalized design. It is one of the leading directions for future package development. The current problem is that the COB reduces the light loss caused by the multiple refractions of the primary optical lens. Therefore, the light extraction efficiency and thermal energy increase still need to be improved, and the production yield of the substrate needs to be improved.

Flip-chip LED chip package is one of the goals of the industry's vigorous development. The fabrication of flip-chip type chips is much simpler than that of three-dimensional type, and it can avoid complicated processes, resulting in a significant increase in the feasibility of mass production. With the help of back-end chip technology, the use of eutectic die-bonding methods greatly simplifies the flip-chip package. The technology threshold, in the future driven by energy-saving and carbon reduction, flip-chip package will be a good solution.

High-voltage LED packaging is also a major focus. The advent of high-voltage products is to solve the problem of excessive energy consumption caused by the existence of a step-down circuit in solid-state lighting, and to help end consumers reduce the cost of purchase, so that different regions can operate under different voltage operating conditions. Get fast and convenient application.

Hotspot 3: LED packaging product upgrades, the price is expected to be lowered step by step

In 2012, the competition of LED packaging products mainly focused on the two main battlefields of LED backlighting and LED lighting. In 2012, mainstream LCD TV backlight LED components on the market will receive new specifications (7030). As for the lighting field, after the price of the product (5630) has dropped to a certain extent, the proportion of applications in the LED lighting market will gradually increase. It is expected that it will be squeezed down to (3014) and (3020) LED packaging products in lighting. Market application.

A large amount of normalization is a problem of wear and tear, which in turn helps terminal consumers reduce their purchase costs. At present, TV backlighting (5630) has dropped by about 4%. (7030) The average bid price does not appear to be very competitive without mass production. However, if production is going smoothly, it is expected that it will be expected to fall sharply by the end of 2012. The rise of notebook computer (NB) applications has led to a maximum drop of 8% in high-brightness 0.8t LEDs. In the mobile phone segment, due to the gradual maturity of specifications, the price reduction is approximately 5 to 6%. In the high-power LED segment, manufacturers are committed to increasing specifications. Clearance of old products, on the whole, the average price decline of about 10% or so; as for LCD backlight products, there have been brand factories to introduce high-current drive 3014 package, can reduce the number of about half of the LED; due to backlight specifications (5630) trend As it matures and the quotation has dropped, more and more lighting application manufacturers use (5630) to make LED tubes or bulbs. The estimated price decline in the first half of 2012 is about 10%.

Currently includes Career, Philips, Nichia Chemical, Seoul Semiconductor, Epistar, Sanan Optoelectronics, Antai Technology, Mingzhi, Jinhong Gas, ROHM, Yuanfang Optoelectronics, Zhongwei Optoelectronics, Zhejiang University, Tricolor, Optoelectronics, Everlight Electronics , Hangke Optoelectronics, Yangzi Electromechanical, Zhongwan Wanbang, Infineon, and China Microelement Energy will collectively debut 2012 Shanghai International New Light & New Energy Lighting Exhibition and Forum.

Hotspot No. 4: Green Lighting's Creativity Layout Four major areas cover the whole industry chain: The LED exhibition will be equipped with epitaxial wafers and chip areas, sapphire and material areas, manufacturing equipment and test areas, and IDEAL Lighting.

IDEAL Lighting perspective innovation and cutting-edge: through the simulation of real hotels, clubs, museums, roads, landscapes, displays, commercial interiors, architecture and other different lighting environments, so that LED lighting display rose to the height of visual arts.

The Summit Forum listened to the latest policy trends: The forum theme “Low Carbon and Innovation, A Bright World of Change” will invite hundreds of top domestic and foreign experts to present speeches, attracting more than 1,000 industry colleagues to attend and listen to the latest industry trends and policy trends.

Shuang Lian Link Office enlarges the promotion effect: This LED Lighting Fair and the largest electronics manufacturing and surface mount industry event in Asia - the 22nd China International Electronics Manufacturing Equipment & Microelectronics Industry Exhibition (NEPCON China 2012) was held in the same period. The two exhibitions have a total exhibition area of ​​more than 40,000 square meters. The participation of more than 700 industry-leading exhibitors will attract more than 20,000 professional visitors to the site.