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The so-called flip chip soldering technology uses metal to metal direct contact, and its high current heat dissipation capability is better than conventional packaging. And Guangmai Electronics will participate in the 2014 High Engineering Golden Globe Awards with their newly launched GP-50WW3-P46T-Z3TC flip-chip eutectic integration module. 
It is understood that the GP-50WW3-P46T-Z3TC integrated module of Guangmai Electronics is mainly made by flip chip. Using DPC technology, it can better adapt to flip chip by solving the problem of flatness and line width of ceramic substrate. In the process, the problem of bubble gap between the substrate and the chip electrode contact layer which is common in the flip chip eutectic is solved. At the same time, a matching plastic gland is also developed to solve the problem that the ceramic basic lock screw is fragile.
"Compared to the formal and vertical chip packaging, the flip-chip LED integrated light source eliminates the need for wire bonding." Li Feng, chief engineer of Guangmai Electronics, told reporters that the process was reduced and the cost was reduced.
Li Feng said that the GP-50WW3-P46T-Z3TC integrated module has the same luminous area and fixed aperture as the conventional integrated module, so it can realize the direct replacement of the conventional traditional integrated module without any change of the conventional lamp housing.
Optical Pulse Electronics has been focusing on the dual improvement of heat dissipation, light efficiency and color rendering index of light sources. Research on a new generation of ceramic light sources and module light sources, winning customers with technology and quality, this time participating in the Golden Globe The integrated module of the award has also been declared related patents.
The reporter learned that the GP-50WW3-P46T-Z3TC integrated module uses a ceramic substrate, which has the characteristics of low thermal resistance and high luminous efficiency, which can reduce the quality of the lamps caused by insufficient heat dissipation and prolong the service life of the module. The module's module efficacy and thermal resistance have reached the domestic leading level. Li Feng told reporters that this module product was just launched in 2014. At present, the foreign market has done a lot, and the sales volume is in a stage of rapid growth.
"Because the domestic flip chip has not yet started, the cost is still relatively high." Li Feng said that he believes that once the domestic flip chip is quantified, the cost of the flip chip eutectic LED integrated module will be further reduced.
At present, the 2014 (5th) High-tech Golden Globe Award - the annual LED good product selection has entered the WeChat voting stage: August 8 - September 30.
If you have already paid attention to the official WeChat LED, please click on the menu bar "Golden Ball Award - I want to vote" under the official WeChat of Gaogong LED Network to vote.
If you have not paid attention to the high-tech LED WeChat, please pay attention to the official WeChat (micro-signal: weixin-gg-led) of Gaogong LED network, and then click on the menu bar "Golden Ball Award - I want to vote" under the official WeChat LED official website. . 
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Optical Pulse Electronics: GP-50WW3-P46T-Z3TC integrated module competes for the 2014 Golden Globe Award
[Text|High- tech LED reporter Yue Mengdi] The popularity of the LED application market has driven the rapid start of the packaging industry. Many LED packaging manufacturers are fiercely competitive. Shenzhen Guangmai Electronics Co., Ltd. (hereinafter referred to as “Guangmai Electronicsâ€) has launched a flip-chip eutectic LED integrated module.