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In the past few years, traditional ceramic substrate manufacturers have mainly gathered in Japan and Taiwan. They hold technical patents, making the price of ceramic substrates high. In recent years, with the domestic ceramic technology catching up, the price of ceramic substrate has begun to loosen, and compared with the aluminum substrate, it has begun to show a strong competitive advantage.
The rapid growth in demand for ceramic substrates has created a potential demand for ceramic substrate manufacturers for high efficiency, high yield and cost effective laser micro-cutting, drilling and dicing equipment.
“The integration of ceramic substrate processing, forming, cutting and scribing must be done with high-precision laser equipment.†Tao Yongmou, general manager of Dongguan Shengxiong Laser Equipment Co., Ltd. (hereinafter referred to as “Shengxiong Laserâ€) said.
At the 2013 Hi-Tech LED Lighting Exhibition to be held at the Guangzhou Poly Exhibition Hall on November 25, Shengxiong Laser will bring its latest Superdriling-600F LED ceramic substrate laser cutting and dicing machine to the show.
Tao Yongmou said that the new laser processing equipment is very high in productivity and yield, and the efficiency increase can bring double the production scale effect to many ceramic substrate manufacturers.
The core part of the laser equipment is generally the two parts of the laser and the software motion control system. In this respect, Shengxiong Laser is a high-quality guarantee by customizing the fiber laser that is most suitable for ceramic substrate cutting.
At the same time, Shengxiong Laser adopts the self-developed strong smart? multi-axis laser control software, powerful software functions can be imported into DXF, DWG, PLT and other formats, mature laser cutting ceramic technology in software, real-time instantaneous adjustment control of laser energy To achieve the integration of cutting, drilling and dicing.
Tao Yongmou said that he is involved in the field of COB ceramic substrate laser cutting equipment under the market opportunity of COB. In the future, Shengxiong Laser will use laser precision processing as a platform to develop more laser equipment suitable for different LED market segments. 
Shengxiong Laser will bring the latest COB ceramic substrate cutting and dicing machine to the 2013 High-tech LED Exhibition
[High-tech LED reporter / Zhou Jin] LED packaging structure and process innovation, the use of multi-chip integrated COB package with its special cost and technical advantages, has been more and more enterprises pay attention. At the same time, higher requirements are placed on the heat dissipation performance of packaged devices. Ceramics have begun to attract more and more manufacturers attention due to their high thermal conductivity.