Global Foundries held its first global technology forum on the 1st of EST, featuring a 28nm analog/mixed signal (AMS) production design process development kit and a new 28nm HPP (High Perfoarmance) Plus) technology is expected to be officially launched to customers in the fourth quarter. It also reveals the 22/20 nm process blueprint and time course for the first time. It is expected to officially enter mass production in 2013. Participants pointed out that the global wafers are technically advanced to 20 nanometers, and the time course is also very similar to TSMC, and TSMC has a strong sense of strength in advanced processes.

In response to the fast-growing smart mobile device market, global wafers are based on the original 28nm HP (High Performance) and 28nm SLP (Super Low Power) processes, followed by 28nm HPP (High Perfoarmance Plus). Global Wafer pointed out that the 28nm HPP process is expected to enter the risk trial production in the fourth quarter of 2011, and the product performance of the process will be 10% higher than the current 28nm HP process.

Compared with TSMC's Gate-Last technology, the 28-nanometer process for global wafers is based on Gate-First technology. Global wafers indicate that many customers have already passed the verification of the crystal in the 28-nm process.

In the technology forum, the global wafer also announced the 28nm analog/mixed signal (AMS) production design process development kit. Global Wafer has partnered with Cadence to jointly launch the main elements of the AMS production design process in the third quarter of 2010. As for the complete production-grade AMS process, it is expected to be launched to customers in the fourth quarter of 2010, and chip verification is planned for 2011. Early year.

Since the global wafer formation, the first global technology forum has been held, so it is also attracting attention from the outside world, especially in the advanced process, and it is one of the focuses. However, the participants pointed out that this global wafer technology forum did not have much surprise. The production capacity and technical blueprint are not far from those announced in the press conference in Taiwan in June, indicating that the company plans to run smoothly, but special The point is that 20 nanometers first joined the global technology roadmap for wafers, and at the time of 28nm and 22/20nm mass production, they are almost identical to TSMC, indicating that the two companies are highly competitive in advanced processes.

It is understood that TSMC will mass-produce 28nm process by the end of the year. In addition to HP and LP processes, there is also a HPL (High Performance Low Power) process developed in cooperation with Xilinx.

Global wafers pointed out that 22/20 nm will be trial production in the second half of 2012 and officially entered mass production in 2013. Among them, the 20nm process will provide HP (High Performance) and SLP (Super Low Power) processes, of which HP process is mainly used for wired devices, and SLP process is used for mobile device applications.

In the next generation of lithography technology, compared with TSMC's deep ultraviolet (EUV) and multiple electron beam two-way, the global wafer pressure EUV camp, it is expected that the first EUV machine will enter the factory in the second half of 2012. And mass production between 2014 and 2015.