Dalian Seminar: Experts share LED unique technology

——Record 2010 LED illuminate Dalian seminar in China

On August 17, 2010, sponsored by Gaogong LED, Dalian Luming Technology Group, Dalian Semiconductor Industry Association, Dalian City Government, Dalian Economic and Information Technology Commission, 2010 LED Illuminated China Tour - National Tour Survey and The sixth seminar of the industry seminar was successfully held in Dalian. The seminar was held in the multi-function hall on the second floor of the Bolt Hotel in Dalian. The meeting held a heated discussion on topics such as technology and patents for the development of the LED industry.

The conference attracted about 100 participants. Liu Yuxi, Director of Semiconductor Division of Dalian Economic and Information Committee, Sun Dapeng, Director of Dalian Jinzhou New District Science and Technology Bureau, Xiao Zhiguo, Chairman of Dalian Luming Technology Group Co., Ltd., and Wuhan Diyuan Optoelectronics Technology Co., Ltd. Manager Dong Zhijiang, sales director of Jiangsu Xinli Optoelectronics Co., Ltd. Gu Zongjun, Ke Rui China senior engineer Wang Xiuru, and Dalian Hongwei Heat Transfer Technology Co., Ltd. general manager Yang Hongwu delivered a speech. Ma Junguo, chief engineer of the Dalian Economic and Information Committee, delivered a speech on behalf of the government.

Liu Yuxi: Status and Future Development of Semiconductor Lighting Industry in Dalian

Liu Yuxi introduced the status quo and future development of the semiconductor lighting industry in Dalian. She pointed out that Dalian, as a national semiconductor lighting industrialization base, always regards the semiconductor lighting industry as a key area in the process of cultivating high-tech strategic industries and developing a green economy to promote energy conservation and emission reduction. To promote. At present, it has a relatively complete industrial chain from substrate materials, epitaxial wafer manufacturing, chip packaging, terminal display devices, lighting fixtures to applications, and nearly 40 LED companies.

Liu Yuxi said that by 2015, the development goal of Dalian LED industry is: more than 60% of urban main roads use LED lighting, 100 sets of MOCVD epitaxial equipment, with an annual output of 2 million epitaxial wafers, with an annual output of 30 billion chips, and the output value exceeds 30 billion yuan. .

At present, the main problems of LED in Dalian--the scale of industrial development is relatively small, the benefits of clusters are not obvious; the lack of innovation ability, lack of core competitiveness; the lack of leading experts and professionals; the public service system is still not perfect; the application promotion is subject to Product price, quality, testing system and other factors.

Liu Yuxi pointed out that Dalian will improve the industrial development environment and highlight the key points of industrial development; build leading enterprises, and make bigger and better leading enterprises such as Dalian Luming Group, Jiujiu Optoelectronics, Century Great Wall, Guangming Chemical Research Institute, and Kelly Chemical; Concentrate, improve the industrial chain; build demonstration projects, accelerate the promotion and application; strengthen market cultivation and development.

Liu Yuxi, Director of Semiconductor Division of Dalian Economic and Information Committee

Xiao Zhiguo: The core technology of semiconductor lighting——Development and breakthrough of LED “core powder”

Xiao Zhiguo introduced the research and development and breakthrough of LED "core powder" from the two core technologies of semiconductor light-emitting chip and luminescent material. He pointed out that the technical advantages of combining LED chip with siloxy phosphor are low light decay and high light efficiency. High color rendering and wide color gamut.

Xiao Zhiguo pointed out that white LED deficiency: low luminous flux, heat dissipation and stability need to be improved, color gamut and color rendering are not good, industry standards are formulated, cost is low, and intellectual property rights; high luminous efficiency and high color rendering White LED preparation elements: chip, phosphor, encapsulation, packaging process, auxiliary materials. The practical phosphors that have been matched with blue LEDs so far mainly include: composite oxides (perovskites), nitrides, nitrogen oxides, niobates, and silicates. In contrast, silicates have high light conversion efficiency. The crystal has good light transmittance and has a broad spectrum excitation band and the like.

Xiao Zhiguo said that patents are the property of enterprises, patents are the magic weapon of competition, and the future patent war is an inevitable war. Luming Technology Group has more than 180 patents at home and abroad, more than 120 projects in the field of luminescent materials, and more than 60 semiconductor chips, including 80% of invention patents and 45% of international patents. There are great breakthroughs in technology: 1. Fully use domestic materials, creatively develop new siliceous luminescent materials for LEDs, with optimized light conversion efficiency, aging resistance, and excellent performance of broad spectrum excitation and intelligent adjustment. . Firstly invented and realized a single material spectral multi-emission peak illumination applicable to white LEDs, and is suitable for double excitation of ultraviolet light or blue light chip; 2. Realizing full light color spectral distribution in the visible light region in the same material system, The technical barrier of color rendering, low color temperature white LED and the consistency and uniformity of packaging products lay a solid foundation; 3. InGaN/AlGaN/GaN multilayer buffer layer technology is used to design epitaxial graded stress type, quantum well structure, Greatly improve the stability and life of the chip application; 4, the first use of siloxy luminescent materials and chips with this core powder integration technology, using energy transfer principle to achieve high color rendering, low color temperature, excellent aging resistance White LED production, LED performance indicators have reached the international advanced level; 5, innovative research on the optimization of luminescent materials and semiconductor chips design, through the optimization of core powder combination to achieve the best luminous efficiency and color rendering performance of white LED; In the industrial chain of white LED, establish a comprehensive intellectual property protection system, break through the patent blockade of international lighting giants such as Nichia and Osram. Monopoly is conducive to the revitalization of the development of China's national semiconductor lighting industry.

Xiao Zhiguo, Chairman of Dalian Luming Technology Group Co., Ltd.

Yang Hongwu: High-power LED lamp integrated heat pipe cooling module

Yang Hongwu pointed out that 20% of LED light-emitting devices become light when energized, and 80% are converted into heat. Heat dissipation is one of the key technical issues of LED lamps. The technical idea for solving the heat dissipation of LED lamps is natural convection, passive, and large enough. Effective heat dissipation area.

The choice of radiator technology solutions to solve the problem of how to use the minimum temperature difference heat dissipation is essentially the transfer technology and method of heat from heat sink to extended heat sink surface. Compared with the traditional method of metal heat conduction, the heat transfer phase change contact area is small, and the effective heat dissipation area of ​​the loop heat pipe is insufficient, the integrated hot plate two-dimensional phase change heat transfer has great advantages: 1. The integrated hot plate is perpendicular to the heat sink and fully utilized. Heat transfer in the phase change process, the thermal resistance value is 0; 2. The extended heat sink fin is perpendicular to the integrated hot plate, perpendicular to the ground and separated from the heat sink / is conducive to the formation of air convection, which is conducive to the elimination of dust and water accumulation; The integrated hot plate, heat sink and extended heat sink fins are made of aluminum alloy material, and the connection between them is welded structure; 4. The integrated hot plate temperature uniformity △T≤2 °C, 200WLED lamp heat dissipation module heat sink thermal resistance Rt≤ 0.075 ° C / W.

According to Yang Hongwu, the high-power LED lamp of Dalian 3D Heat Transfer Technology Co., Ltd. integrates the hot plate heat dissipation module, the thermal resistance is 15 °C - 30 °C, the weight is 15g / W - 25g / W, and the light efficiency is increased by 3% -5 %, more than double the life expectancy, widely used in street lamps, mining lights, cable lights, shoe box lights, multi-function lights and other applications.

Yang Hongwu, General Manager of Dalian 3D Heat Transfer Technology Co., Ltd.

Dong Zhijiang: Research progress and development trend of LED power chip lighting improvement for lighting

Dong Zhijiang pointed out that the current application fields of LED high-power chips for lighting are mainly in the fields of indication, display, backlight and illumination. The requirements for chips in each field are different, such as size, light efficiency, reliability, etc. Especially in the application of LED lighting, the harsh environment of LED lighting puts higher demands on the heat dissipation and temperature shock of the device. In the speech, Dong Zhijiang said that as LEDs follow the light effect, as long as the light efficiency is improved, the price will drop. For every 1% increase in luminous efficiency, you can save $2 billion annually.

Dong Zhijiang believes that the development of the LED lighting industry depends on three points: higher luminous efficiency, lower cost and better thermal management technology and reliability. To improve LED light efficiency, Dong Zhijiang proposed to improve LED light efficiency by improving internal quantum efficiency and light extraction efficiency (EQE). Among them, methods for improving internal quantum efficiency include: patterned substrate (PSS) technology, pGaN coarsening, hydride vapor phase epitaxy (HVPE), quantum dots, quantum wire MQW growth technology, roughened semi-polar, and non-polar epitaxy. Distributed Bragg Reflection (DBR) and Side Corrosion (LBR) techniques can be used to increase light extraction efficiency.

At the meeting, Dong Zhijiang outlined the research results of industrialization of 100lm/W high-power chips. The 100lm/W high-power chip is applied to indoor lighting fixtures. Through 1000-hour high-temperature accelerated aging (450mA) test, chip normal temperature life test and related data comparison, he believes that LED epitaxy and chip are the core technologies to solve luminous efficiency and thermal management.

Finally, Dong Zhijiang also briefly introduced Diyuan Optoelectronics Semiconductor Lighting Industrial Park. Diyuan Optoelectronics is positioned in LED lighting high-power epitaxy, chip research and development and production. Diyuan Optoelectronics produces power LED chips with higher lm/$, cost-effective high.

Dong Zhijiang, General Manager of Wuhan Diyuan Optoelectronics Technology Co., Ltd.

Gu Zongjun: Ultra-high power lighting grade LED metal packaging technology

Gu Zongjun briefly stated the current status of the LED lighting application industry. As an emerging field, many lighting industry colleagues encountered some difficulties in the process of manufacturing LED lamps, and hindered the effective promotion of LEDs. He summarized these difficulties mainly include: 1. The light source is unstable and the life is short; 2. The power quality is poor and the fault is many; 3. The light distribution is difficult and the glare is strong; 4. The production process is complicated, the input cost is high, the time is long, and the good product is good. The rate is low.

Gu Zongjun pointed out that the light source characteristics of Xinli Optoelectronics - low power consumption: the same power consumption is only 40% of the sodium lamp; high light efficiency: luminous efficiency of up to 100-110lm / w; low light decay: continuous work 2000 hours, Light decay rate is less than 0.1%; good heat dissipation performance: full metal packaging technology, fast heat conduction; high color rendering index: Ra>=75; excellent light distribution: high borosilicate glass lens, light transmittance up to 95%, free Light distribution; fast response time: response time is 60 nanoseconds (ns), instant lighting; long working life: light source working life up to 50,000 hours; green: no lead, pump and other pollution elements, no pollution to the environment High degree of protection: compact structure, impact resistance, anti-aging, IP65 protection, maintenance-free.

Through the comparison of LED products in different packaging processes, Gu Zongjun introduced the technological features of Xinli Optoelectronics LED products, including: light source, lens, collar, copper bracket, aluminum base and light decay. Finally, Gu Zongjun also introduced Xingli Optoelectronic's unique LED package structure won the national invention patent - a principle and application of a super-power lighting-level LED metal package structure, and showed the Xinli photoelectric road lamp series, floodlight Light series and explosion-proof light series products.

Gu Xinjun, Sales Director, Jiangsu Xinli Photoelectric Co., Ltd.

Zhang Xiaofei: LED industry inventory in the first half of 2010

First of all, Zhang Xiaofei took stock of the top ten hot topics in the LED industry in the first half of the year, that is, "the price increase of the chip is against the historical trend?", the ten cities are no longer hot, the two LED companies are listed domestically, and "multiple standards are introduced to the industry." The chaos is still not over," EMC spoiled the LED industry, LED TV penetration exceeded expectations, optoelectronic industry parks were tight, overseas markets accelerated the popularization of LED lighting, high-power chip light effects to achieve new breakthroughs, traditional lighting accelerated to LED lighting.

Regarding the price increase of the chip, he analyzed the price increase phenomenon and the reasons, and believed that the price increase of the chip will continue until the second quarter of next year, after which there will be a continuous decline, and the situation of continued decline in chip prices after next year will continue. . Last year, the ten cities and cities were still in full swing, but this year they were cold and the heat was no longer. The so-called "Ten Cities and Ten Thousand Miles" goal has been difficult to achieve, and the installation of LED street lights will increase steadily and slightly this year and next.

With the high-profile listing of Guoxing and Ganzhao in China, 43 LED companies have completed the share reform. Zhang Xiaofei believes that the situation of LED companies' stock price surge has ceased to exist, and the market and investors are also restoring rationality. Although there are a number of standards currently in place, the confusion in the LED industry is still not over. Coupled with the full bloom of local standards in the first half of this year, China's LED standards have been in a state of long-term management. In essence, local standards hinder the development of industries across the country.

In the first half of this year, some EMC cases were launched in various places, with the largest number in Guangdong. At present, EMC is facing many obstacles. Zhang believes that EMC will still develop in the process of exploration, and with the advancement of LED technology, price decline, and various systems, the feasibility will gradually increase. 2010 is the year of LED backlight TV explosion, LED backlight TV is regarded as the mainstream of the future TV market. When 3D TV is being promoted with great fanfare, LED TV has quickly completed its preemption of the market. GLII predicts that the market share of LED-backlit TV will increase from 7% in 2009 to 35% in 2010. It is estimated that China's domestic LED TV manufacturers plan to produce 5.5 million units in 2010. At present, the optoelectronic industrial park has fierce competition for investment, and the “war for investment” in various industrial parks is extremely fierce. The government introduces “hidden rules” and various localities are competing to introduce attractive policies.

The overseas market has accelerated the popularization of LED lighting. As the purchasing power of developed countries will be strong, the difference between traditional lamps and LED lamps in developed countries is smaller than that of developing countries. They are at the forefront in popularizing LED lighting. GLII survey data: In the first quarter of 2010, China's LED application output value was 19.9 billion yuan, a year-on-year increase of 42%. The surge in overseas demand is an important reason.

A new breakthrough in high-power chip light efficiency, CREE announced that its high-power chip achieved 208lm / W @ 350mA. In the past few years, the efficiency of LED production chips has increased at a rate of 15 lm/W per year. The efficiency of high-power chips in 2010 is expected to reach 30 lm/W. Since most chip manufacturers use sapphire substrate technology, the light efficiency of this technology route is growing slowly.

Traditional lighting accelerates the shift to LED lighting. The scale of traditional lighting has increased from 62.5 billion US dollars in 2009 to 96.8 billion US dollars in 2010, and is expected to reach 154 billion US dollars in 2012. LED lighting from $2.5 billion in 2009 to $3.2 billion in 2010 is expected to reach $5.29 billion in 2012. From 2009 to 2012, the compound annual growth rate will reach 28.5%.

Gaogong LED CEO Zhang Xiaofei