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Recently, Foshan Guoxing Optoelectronics Co., Ltd. (hereinafter referred to as “National Star Optoelectronicsâ€) announced that its self-developed “a surface mount power LED bracket manufacturing method and its products†was patented. This patent is Expanded and continued innovation on the innovative technology route of National Star Optoelectronics' original PCB+copper column.
Dr. Li Cheng, assistant to the general manager of Guoxing Optoelectronics and director of the R&D Center, said that the patent is about the high-power structure and basic manufacturing method of the press-fit PCB. At present, few manufacturers in China have put forward their own ideas on the new packaging structure and industrialized them. Guoxing Optoelectronics has done it. On the one hand, these new technologies avoid patent barriers in structure and method. On the one hand, they can reduce cost, improve manufacturability and have better heat dissipation performance than ceramic substrates.
Nowadays, LED lighting devices are developing toward high light efficiency, high light color quality, high reliability, and low cost, while the devices for LED display screens are moving toward high density, high contrast, and high reliability. After years of continuous research and development in technology, the domestic technical route and technical level have gradually moved closer to the international level. The field of packaging has been changing with the development of foreign device models, and many manufacturers have reinvented while absorbing foreign technology. Especially in terms of COB, domestic manufacturers have greater autonomy in size and power models.
With international standards
At present, for large projects and important customers, many companies still prefer to use foreign chips or even packaged devices. The most important considerations are reliability and intellectual property issues.
In recent years, many domestic manufacturers have begun to prefer to use and select domestic chips and devices. After all, domestic packaged devices have better cost performance and have a unique price advantage in terms of exports. Li Cheng said that last year, the first few major display manufacturers in the world have already negotiated with us to use our packaged devices. This is a good start. Guoxing Optoelectronics has become the leader of domestic packaging in the field of display device packaging, even the industry technology. Benchmarking.
"But we have to admit that there is a certain gap between domestic packaging and international packaging devices." Li Cheng said that the reasons for this gap are multifaceted, not only due to equipment and chips, but also brackets including accessories. Plating, bonding wires, etc. can also have a significant impact on product quality. In terms of process control, domestic packaging manufacturers should also learn from international packaging factories, such as equipment commissioning and process conditions optimization, and even on-site management, such as material certification process, reliability verification, static electricity and moisture control.
Chips and devices were previously two key factors affecting the quality of packaged devices, but the basic difference is currently small. Domestic packaging manufacturers can easily buy high-end foreign materials, but even if all high-end products are still far from the foreign products in terms of quality, domestic packaging factories have to consider in detail.
"The domestic price war is too hot, leading to a lot of opportunistic and shoddy opportunistic behaviors." Li Cheng said. The reporter visited and found that many packaging manufacturers have done the best in order to reduce costs, and the process can save provinces. The end result is that the device is prone to quality problems in harsh environments.
“Many packaging companies don’t pay much attention to certification, and they often think that this is an additional cost.†Li Cheng believes. There are not many certifications for LED package devices. Currently, only the Energy Star LM-80 lifetime maintenance rate and 62471 biosafety are available.
LED packaged devices are just industrial middleware, and more are system testing and certification during luminaire applications. Many LED lamps are now being returned overseas for many reasons, such as safety regulations, power supply, light decay, and failure.
LED device manufacturers should also pay attention to it. In fact, there are many test standards or reference standards for LED light color analysis and testing, environmental reliability, etc. LED device manufacturers should do this work in the development process, otherwise they will easily push There may be quality risks in the market.
Unfinished , please refer to the April issue of Gaogong LED 's " LED Good Products" magazine. 
Guoxing Optoelectronics: Domestic LED packaged devices are counter-attacking
[Source: Gaogong LED 's " LED Good Products" magazine April issue (P14) reporter / Long Zonghui]