Lei Feng Net Note: This article by SITRI, this article introduced the iPhone 7 plus various parts of the analytical report. In the apple release season, the grand festival of fruit powder was on schedule. Although before the release, information about the new generation of products has been revealed through various channels, the lack of revolutionary technological innovations has made the market not optimistic about the iPhone 7/7 Plus. However, after the launch of the product, product reservations and sales are surprisingly hot. In particular, the iPhone 7 Plus is hard to find, the sales of the iPhone 7/7 Plus are historically close to 1:1, and the large-size Plus has a higher level. Hardware configuration and brand new features have become the real flagship phones in the iPhone series. SITRI arrived as expected. The first time in the global release of iPhone's new in-depth analysis report, with everyone exploring the technology trends of the Apple empire! Machine structure diagram Main parts diagram The A10 Fusion chip's central processor adopts a new quad-core design with two high-performance cores and two high-efficiency cores that can be used to achieve the desired performance and energy efficiency performance based on different needs. Die Photo Function Block Distribution The home screen button adopts a solid-state button design, which is not only robust and responsive, but also supports force sensing. With the Taptic Engine, it provides precise tactile feedback when pressed. iPhone6s Plus and iPhone7 Plus Home Button Comparison Chart The new iPhone has a relatively good upgrade in terms of hardware configuration and functionality compared to its predecessor. However, it has not produced much in the current mobile phone market. The iPhone has always led the industry trend with its leading design and craftsmanship. Today, the iPhone is no longer leading in innovation, LG G5 has a dual rear camera and works similar to its; a plus 3 mobile phone Home key function concept is consistent with the iPhone 7 Touch ID; music as the Max2 also first to remove the 3.5mm headphone jack The design of stereo speakers has long appeared in HTC products; however, practical functions such as fast charging and wireless charging have not appeared in this product. Compared to the product configuration and functional design of premature exposure and no bright spots, various sensors supported by the application function are still mysteries, and SITRI will unveil you one by one. In addition to the iPhone 7 Plus has a 12 million-pixel wide-angle camera lens, but also with a 12 million-pixel telephoto lens, you can do 2x optical zoom and up to 10x digital zoom. The dual camera system, combined with the A10 Fusion chip's built-in image signal processor technology, can improve the quality of photos and videos. The upcoming depth-of-field effect is expected. The dimensions of the two cameras are different, and the SITRI team will conduct detailed analysis later. Module Photo Module X-Ray Photo Telephoto Image Sensor Die Photo Telephoto Image Sensor Lens Front camera Package Photo Sensor Die Photo Sensor Lens OM Photo The Home button is retained on the iPhone 7, and the brand new "pressing" experience has also attracted widespread public attention. Through intuitive comparison, we can see that the shape of the module has changed from the iPhone's consistent square shape to a simple round shape. The diameter of the circular module is 10.55mm, and the module thickness is 1.55mm. The fingerprint sensor chip and control chip in the module are not significantly different from the previous generation iPhone6s Plus. Module Overview and X-Ray Photo Sensor Package X-Ray Photo Sensor Die Photo ASIC Die Photo ASIC Die Mark Compared to the previous generation iPhone6s Plus, Apple’s inertial sensor suppliers still use Invensense. However, the design of ASIC Die is different from the previous generation of products. The following table lists the differences in specific dimensions. The comparison of the following pictures also clearly shows the specific differences between the chip layout and the chip Mark. Package Photo (iPhone7 Plus) Package X-Ray Photo Die Photo & Die Mark & ​​SEM Cross Section (iPhone7 Plus) Die Photo & Die Mark (iPhone6s Plus) MEMS Die Photo and Die Mark (iPhone7 Plus) MEMS Die Photo and Die Mark (iPhone6s Plus) Electronic compass The geomagnetism products of ALPS have appeared on the iPhone7 Plus this year for the first time since last year's appearance on iPhone6s Plus products. Except Mark's slight change, the rest has not changed much. Its package size is 1.60 mm x 1.60 mm x 0.70mm. Package Photo Electronic Compass ASIC Die Photo Electronic Compass ASIC Die Mark Electronic Compass Sensor Die Photo (X-Axis, Y-Axis, Z-Axis) Electronic Compass Sensor Die Mark (X-Axis, Y-Axis, Z-Axis) The ambient light sensor of the iPhone7 Plus still follows the previous design, using the same AMS TSL2586 as the iPhone6s Plus. The package size is 1.78 mm x 1.35 mm x 0.58 mm. Die Photo Die Mark The distance sensor and previous design of iPhone7 Plus have made great changes and breakthroughs. The distance sensor package size is 2.90 mm x 2.50 mm x 1.25 mm, which is similar to the iPhone 6s Plus package size. The obvious difference between iPhone7 Plus and iPhone6s Plus can be seen from the package comparison picture below. Package Photo (iPhone7 Plus) Package Photo (iPhone6s Plus) The following figure is a comparison of the package X-Ray. It can be seen that the iPhone 7 Plus package is simpler and uses the Stack Die process. The Emitter chip is directly stacked on the ASIC chip. The Receiver chip is integrated on the ASIC chip. There is no package isolation between the two, and the distance sensor of the iPhone6s Plus uses a common distance sensor package. There is a package isolation between Emitter and Receiver and there is no ASIC chip in the package. This direct placement of the ASIC chip inside the proximity sensor enables faster and more accurate data transmission. Package X-Ray Photo (iPhone7 Plus) Package X-Ray Photo (iPhone6s Plus) ASIC Die Photo (with Receiver)-iPhone7 Plus ASIC Die Mark (with Receiver)-iPhone7 Plus The development trend of proximity sensors is to replace LEDs with lasers, which can shorten the reaction time and improve the distance recognition performance. It may be used to support gesture sensing in the future. Apple’s attempt to update the distance sensor on the iPhone 7 Plus may be due to consider. Apple continues to use the Bosch pressure sensor with a package size of 2.50 mm x 2.00 mm x 0.82 mm. The layout of the ASIC chip is quite different from the iPhone 6s Plus. Package Photo Package X-Ray Photo ASIC Die Photo ASIC Die Mark MEMS Die Photo MEMS Die Mark One of the iPhone7 Plus's four microphones is from STMicroelectronics, two from the Falcons, and one from Goethe. Microphone 1 (located at the top of the phone - front) Microphone 1 comes from STMicroelectronics and has a package size of 3.30 mm x 1.95 mm x 0.77 mm. Package Photo Package Cap Removed Photo Package X-Ray Photo ASIC Die Photo ASIC Die Mark MEMS Die Photo MEMS Die Mark MEMS Die SEM Sample Microphone 2 (located next to the rear camera) Microphone 2 comes from Knowles and has a package size of 3.25 mm x 1.90 mm x 0.77 mm. Package Photo Package Cap Removed Photo Package X-Ray Photo MEMS Die Photo MEMS Die Mark Microphone 3 (at the bottom of the phone) Microphone 3 is also from Knowles and has a package size of 3.25 mm x 1.90 mm x 0.75 mm. MEMS Die is the same as microphone 2. ASIC Die has some differences in size and Bonding line from the existing data. Package Photo Package Cap Removed Photo Package X-Ray Photo The MEMS Die Photo of the microphone 3 is the same as the microphone 2 and will not be described here. Microphone 4 (at the bottom of the phone) The microphone 4 comes from Goer acoustics and has a package size of 3.30 mm x 1.95 mm x 0.78 mm. Package Photo Package Cap Removed Photo Package X-Ray Photo MEMS Die Photo In summary, the iPhone 7 Plus still does not appear in the heart rate sensor, and other sensor chips are updated than the previous product, especially the use of an integrated distance sensor to replace the previous discrete device, follow-up we will on the iPhone 7 Plus A10 processor, fingerprint module, dual camera, distance sensor and complete machine design do further detailed analysis, so stay tuned! Lei Fengwang Note: This article is authorized by SITRI to release Lei Feng Network (search "Lei Feng Net" public concern) , if you need to reprint please contact, and indicate the author and source, not to delete the content. Investment Casting, also known as lost wax casting, includes wax pressing, wax repairing, tree formation, paste, wax melting, casting metal liquid and post-treatment processes. 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