The download document describes the design of a new type of flat-panel high-power light-emitting diode ( LED ) lighting device with shutters. The device uses a high thermal conductivity aluminum substrate as a heat dissipation circuit board for a plurality of high-power LEDs, and uses 0.4 mm aluminum sheets as heat dissipation fins, and combines a grooved micro heat pipe to form an integrated input and output power of 21 W. A lighting module that can reconfigure lighting devices of different powers according to lighting brightness requirements.

1 Introduction

Compared with high-pressure sodium lamps, which are the most used in road lighting, high-power LEDs have the advantages of color temperature selection, high luminous efficiency, high pressure, high brightness, high color rendering and long life. Thermal issues are the biggest barrier to limiting high-power LED lighting applications. After researching a new method for packaging silicon-based multi-chips, a metal bonding method for LED packages that can effectively reduce thermal resistance has been found. That is, the vertical carbon nanotubes are directly bonded to the aluminum substrate as the bonding material, and the grown carbon nanotubes are used as the thermal boundary material, and the heat dissipation effect is obtained. A new type of heat sink has been developed to achieve the cooling of high power LEDs. A heat pipe heat dissipation model of LED is also proposed, and the junction temperature and thermal resistance are greatly reduced. The heat dissipation performance of bonding the LED to the micro heat pipe was studied, and the micro heat pipe can reduce the temperature of the chip more.

The principle, experimental setup, measurement procedure, and factors affecting test results of high power LED thermal resistance and junction temperature are measured using dynamic electrical test methods. The finite element simulation was used to analyze the temperature and thermal stress distribution during the working process, and the temperature variation of the actual device surface feature points was tested. The microchannel cooling structure of high-power LED array package was designed, and the influence of various parameters on the heat dissipation effect of LED multi-chip was discussed. The high-power LED active cooling scheme of micro-jet flow is studied to realize efficient heat dissipation of high-power LED chipset . The thermal characteristics of high-power lGaInP red LEDs on three kinds of heat-dissipating substrates were analyzed by finite volume numerical simulation, transient thermal resistance test method and temperature-peak wavelength variation of heat sink. A new type of loop heat pipe was proposed and its performance test experimental device was established.

At present, research at home and abroad focuses on LED thermal resistance, junction temperature measurement and the use of packaging methods to reduce thermal resistance. Aiming at the lighting application requirements of high-power LEDs, this paper proposes a modular structure design scheme of a new type of louver-type high-power LED lighting device integrated with micro-heat pipes, and simulates and experimentally studies its heat dissipation performance.

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