First, the chip material itself is broken
If the chip breakage is greater than 1/5 of the width of the single-sided chip or the break is at an oblique angle, each side is longer than 2/5 chips or damaged to the aluminum pad. Such chips are unacceptable (this is a project in the chip inspection standard) . The main causes of the bad phenomenon are:
1. The chip manufacturer is not working properly.
2, chip incoming inspection has not been sampled
3, did not pick out when working online
Solution:
1. Inform the chip manufacturer to improve
2. Strengthen the inspection of incoming materials, and reject the chip with too much damage.
3, online Q inspection, damaged chips should be picked out, and then make up a good chip.
Second, the LED solid crystal machine is used improperly
1. Improper suction parameters of the machine
The nozzle height and the solid crystal height of the machine are directly controlled by the parameters in the computer of the machine. The parameters are large, the suction height is small; the parameters are small, the suction height is large, and the chip is damaged or not, which is directly affected by the suction height parameter of the machine. The main reasons for the bad phenomenon are: large parameters of the machine, low hunting height, excessive force on the chip, resulting in chip damage.
Solution:
Adjust the parameters of the machine, adjust the height of the nozzle or the height of the solid crystal. Adjust the height of the nozzle in the first “PickLevel†in the “Bondheadmenu†in the “SETUP†mode of the machine, and then adjust the second “BondLevelâ€. Solid crystal height.
2, the size of the nozzle does not match
Chips of different sizes must be fixed with different nozzles. Large chips can be easily leaked with small nozzles and chips. Small chips can be easily broken with large nozzles and chips. Therefore, the selection of appropriate nozzles is a prerequisite for solid chips. The cause of the bad phenomenon is that the nozzle is too big to break the chip.
Solution: Choose the appropriate porcelain nozzle.
Third, artificial rupture caused by improper operation
A, improper homework
Failure to follow the instructions, so that the chip is broken. The main causes of the bad phenomenon are:
1. The material is not taken well and dropped to the ground.
2, hit the chip when entering the oven
Solution: When taking the material, keep your hands steady. When entering the oven, the material should be flat and gently put in. Do not tilt or use excessive force.
B, heavy object crush
The chip was broken due to excessive external force. The main reasons for this kind of bad phenomenon are:
1. The microscope falls onto the material, breaking the chip
2. The parts of the machine are dropped onto the material.
3, the iron plate is pressed to the material
Solution:
1, the microscope screw should be locked
2. Regularly check whether the parts of the machine are loose.
3. There must be no objects such as iron plates on the material.
LED solid crystal cracking solution
Single-electrode chips have very high requirements for solid crystal in the packaging industry. For example, in the LED production process, the quality of the solid crystal affects the quality of the finished LED products. There are many factors that cause LED solid crystal cracking. We only discuss the solution of LED solid crystal cracking from three factors: material, machine and man-made.