The technical realization process of PCB copy board is simply to scan the board to be copied, record the detailed component position, then remove the components to make a bill of materials (BOM) and arrange material procurement. Scanned into a picture and restored to a pcb board file by the copy board software, and then sent the PCB file to the plate making board. After the board is made, the purchased components are soldered to the fabricated PCB board, and then tested by the board. And debugging can be.

The specific steps of PCB copy board:

The first step is to get a PCB. First, record the model, parameters, and position of all the components on the paper, especially the direction of the diode, the three-stage tube, and the direction of the IC notch. It is best to take a photo of two positions at the digital camera with a digital camera. The current PCB board is getting higher and higher. The above diode triode is not noticed at all.

In the second step, all the multi-layer board parts are removed, and the tin in the PAD hole is removed. Clean the PCB with alcohol and put it into the scanner. When scanning, the scanner needs to slightly raise some scanned pixels to get a clearer image. Then polish the top and bottom layers slightly with water gauze, polish it to the copper film, put it into the scanner, start PHOTOSHOP, and scan the two layers in color. Note that the PCB must be placed horizontally and vertically in the scanner, otherwise the scanned image will not be used.

The third step is to adjust the contrast and brightness of the canvas so that the portion with the copper film and the portion without the copper film are strongly contrasted, then turn the secondary image to black and white to check whether the line is clear. If it is not clear, repeat this step. If it is clear, save the image as black and white BMP format files TOP.BMP and BOT.BMP. If you find any problems with the graphics, you can use PHOTOSHOP to fix and correct them.

The fourth step is to convert the two BMP files into PROTEL format files, and transfer them into two layers in PROTEL. If the two layers of PAD and VIA are basically coincident, it indicates that the first few steps are very good. If there is a deviation, repeat the third step. Therefore, pcb copy board is a very patient work, because a small problem will affect the quality and the degree of matching after copying.

In the fifth step, convert the BMP of the TOP layer to TOP.PCB. Note that the layer to be converted to the SILK layer is the yellow layer. Then you trace the line in the TOP layer and place the device according to the drawing in the second step. Remove the SILK layer after painting. Repeatedly knowing to draw all the layers.

In the sixth step, TOP.PCB and BOT.PCB are transferred in PROTEL, and it is OK to combine them into one figure.

In the seventh step, the TOP LAYER and BOTTOM LAYER are printed on the transparencies (1:1 ratio) by laser printer, and the film is placed on the PCB. If there is any mistake, if you are correct, you are done. .

A copy board like the original one was born, but it was only half done. Also test, test the electronic technology performance of the copy board is the same as the original board. If it is the same, it is really done.

Remarks: If it is a multi-layer board, carefully polish it to the inner layer, and repeat the steps of the third to fifth steps. Of course, the naming of the graphics is different. According to the number of layers, the general double-panel copy board should be It is much simpler than a multi-layer board, and a multi-layer copy board is prone to misalignment, so the multi-layer board is particularly careful and careful (internal vias and non-vias are prone to problems).

Double panel copy board method:

1. Scan the upper and lower layers of the circuit board and save two BMP pictures.

2. Open the copy board software Quickpcb2005, click "File" and "Open Basemap" to open a scanned image. Use PAGEUP to enlarge the screen, see the pad, press PP to place a pad, and see the line press PT.... Just like the child's drawing, draw it in this software and click “Save” to generate a B2P file.

3, then click "File" "Open Basemap" to open another layer of scanned color map;

4, then click "File" "Open", open the previously saved B2P file, we see the newly copied board, stacked on top of this picture - the same PCB board, the hole is in the same position, but the line connection is different . So we press "Options" - "Layer Settings", where the lines and silkscreens showing the top layer are turned off, leaving only a multi-layer via.

5. The vias on the top layer are in the same position as the vias on the bottom image. Now we can trace the underlying lines as we did in childhood. Then click "Save" - ​​the B2P file at this time has the top and bottom layers of data.

6. Click “File” and “Export as PCB File” to get a PCB file with two layers of data. You can change the board or send out the schematic or directly send the PCB plate making factory to produce multi-layer board copying method:

In fact, the four-layer board copy board is to duplicate two double-panel, the sixth layer is to repeatedly copy three double-panel... The reason why the multi-layer is daunting is because we can't see the internal wiring. A sophisticated multi-layer board, how do we see its inner layer? - Layering.

There are many ways to stratify now, such as etched water, knife peeling, etc., but it is easy to separate the layers and lose data. Experience tells us that sanding is the most accurate.

When we finish the top layer of the PCB, we usually use sandpaper to polish the surface layer to show the inner layer. The sandpaper is the ordinary sandpaper sold by the hardware store. Generally, the PCB is tiled, then the sandpaper is pressed and rubbed evenly on the PCB. (If the board is small, you can also flatten the sandpaper and use a finger to hold the PCB and rub it on the sandpaper). The point is to flatten out so that it can be evenly ground.

The silk screen and the green oil are generally wiped off, and the copper wire and the copper skin should be wiped a few times. In general, the Bluetooth board can be wiped in a few minutes, and the memory stick is about ten minutes; of course, the strength is great, the time spent will be less; the time spent on the small flower will be a little more.

Grinding is the most common solution for stratification, and it is also the most economical. Let's try to find a piece of discarded PCB. In fact, there is no technical difficulty in grinding the plate. It is just a bit boring. It takes a little effort. You don't have to worry about grinding the plate to your fingers.

PCB diagram effect review

During the PCB layout process, after the system layout is completed, the PCB diagram should be reviewed to see if the layout of the system is reasonable and whether the optimal effect can be achieved. It can usually be examined from the following aspects:

1. Does the system layout ensure that the wiring is reasonable or optimal, whether the wiring can be reliably carried out, and whether the reliability of the circuit operation can be guaranteed. In the layout, you need to have an overall understanding and planning of the direction of the signal and the power and ground network.

2. Whether the size of the printed board is consistent with the size of the processed drawing, whether it meets the requirements of the PCB manufacturing process, and whether there is a mark of behavior. This point requires special attention. Many PCB layouts and layouts are designed to be beautiful and reasonable, but neglecting the precise positioning of the positioning connectors, resulting in the design circuit not being able to interface with other circuits.

3. Whether the components have conflicts in two-dimensional or three-dimensional space. Note the actual size of the device, especially the height of the device. In the welding-free layout of components, the height can not exceed 3mm.

4. Whether the layout of the components is dense and orderly, neatly arranged, and whether all of them are finished. In the layout of components, not only the direction of the signal and the type of signal, the place that needs attention or protection, but also the overall density of the device layout should be considered, so that the density is uniform.

5. Whether the components that need to be replaced frequently can be easily replaced, and whether the plug-in board is convenient to insert into the device. It should be convenient and reliable to replace and plug in frequently replaced components.

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