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Recently, Hongli Optoelectronics announced the launch of its new flip-chip COB-ceramic based LC003 product at its LED packaging technology and new product launch conference. This is a small-volume, high-density, concentrating light source that is representative of high-density LED arrays and offers more possibilities for LED lighting in high lumen density applications. 
As a key high-tech enterprise dedicated to the research and production of high-end LEDs, Hongli Optoelectronics has domestic leading white LED packaging technology and high-power LED packaging technology. In 2010, 2012 and 2013, China's lighting white LED packaging enterprise competitiveness Ranked first, the first domestic COB package output value in 2014 (GLII ranking).
According to market demand, Hongli Optoelectronics released the new COB CO003, power 20W-70W, with small volume, high lumen density and concentrating characteristics. Can meet MacAdam 3rd order sorting, in line with ANSI spectroscopic standards, color temperature covers 2700-6500K, color rendering index is 70, 80, 90, 95 respectively. 
Figure 1. Product color reduction under different color rendering indexes
Compared with the current dressing products on the market, the inverted COB LC003 shows its outstanding technical advantages in terms of life, luminous flux and color rendering index.
First, its light output is uniform, and the color tolerance is less than or equal to 3;
In addition, it has low thermal resistance and good heat dissipation;
Secondly, it has high light quality, high index, and generally refers to more than 80, which can meet the color reduction of different scenes;
In addition, because there is no gold wire package, there is no risk of dead lights.
In particular, at the same power, as the temperature increases, the maintenance rate of the "hot lumen" of the flip-chip product is higher than that of the mirror-coated aluminum product (the heat lumen refers to the junction temperature of the LED when it reaches stable operation (70-120). The luminous flux emitted in the °C) state). 
Figure 2 Mirror surface aluminum product comparison flip-chip product heat lumen curve at the same power
For the application direction of the product, Wang Gaoyang pointed out that “low thermal resistance, high heat dissipation, no gold wire, high reliability, simplified production process, improved efficiency, and the characteristics of the flip-chip eutectic process determine the application direction of the product. The features and technical advantages of COB make it ideal for high-power and outdoor lighting products such as mining lamps, tunnel lights, track lights and Par lights."
"Intelligent lighting and optical communication technologies with features such as diversified functions, unlimited creativity and enhanced compatibility will become the future development trend of this product." Wang Gaoyang finally stressed. 
Hongli Optoelectronics: the first small volume high lumen density source flip COB
[Text|High-tech LED reporter Luo Shenghua] "As a representative product of high-density LED arrays, flip-chip COB can provide more possibilities for LED lighting in the application of high lumen density applications." Gao Yang previously said that the inverted COB is indicated.